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Via system-on-module to debut at IoThings in Rome

Steve Rogerson
November 16, 2017



Next week’s IoThings conference in Rome will see the European debut of Via Technologies’ SoM-9X20 module powered by a Qualcomm Snapdragon 820 embedded platform
 
The system-on-module (SoM) harnesses the performance and low power consumption of the Snapdragon 820 embedded platform for enabling the rapid development of a variety of enterprise IoT and embedded system applications ranging from human-machine interfaces, surveillance and digital signage to robotics, cameras and video conferencing.
 
“The rapid proliferation of the IoT is opening up a wealth of opportunities for companies to boost the efficiency of their operations and develop exciting new products and services,” said Richard Brown, VP of international marketing for Taiwan-based Via Technologies. “With leading-edge solutions such as the SoM-9X20, we provide enterprises with an unrivalled choice of highly-scalable, ultra-reliable platforms that can be rapidly customised to unlock the full potential of their IoT deployments.”
 
In addition to the SoM-9X20 module, highlights on display will include commercial-grade systems, HMI starter kits and IoT acceleration platforms that can be customised for smart transportation and smart city applications.
 
Designed to serve as the lynchpin within the smart home ecosystem, the OCF certified Alegro 100 multiprotocol home gateway router is Via’s latest IoT Studio innovation. Supporting all the most popular wireless standards, it orchestrates cross-protocol communications between a wide range of connected devices, enabling remote monitoring and control of a smart environment directly from a smartphone or tablet.
 
Already deployed by one of the leading taxi companies in Japan, the AMos-825 smart taxi IoT acceleration platform combines the AMos-825 system with an LCD monitor to provide flexibility and ruggedness for enabling applications and services such as navigation, route tracking, driver notifications, passenger pick-ups and electronic payments
 
Combining an integrated 9cm SBC form factor motherboard with an optional 25.8cm touch panel screen, the VAB-630 comes with a raft of compute, graphics and video features to ensure performance for interactive multimedia applications in kiosks and signage displays.
 
The SoM-6X50 Arm-based module measures 6.76 by 4.3cm and is powered by a 1.0GHz Via Cortex-A9 SoC to deliver a balance of performance and multimedia features in a flexible package for a wide range of IoT automation and HMI applications.
 
Also as part of the Exhibitor’s Forum, Giuseppe Amato, technical manager for Via Embedded, will be presenting a paper discussing smart implementation for IoT.
 
Via has also launched the Artigo A630, a slim fanless gateway with flexible customisation options for commercial M2M and IoT applications.
 
Featuring a 1.0GHz Vis Cortex-A9 dual-core SoC, multiple network connectivity options, and a combination of IO, the gateway is designed to manage the connection and control for connected HMI and automation applications.
 
“The Via Artigo A630 bolsters our already diverse range of Artigo series M2M and IoT gateway systems,” said Brown. “Providing a rich mix of connectivity and performance in an ultra-compact design that can be rapidly customised, will help customers speed time-to-market and unlock the full potential of their IoT deployments.”