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Thin Film awarded grant to develop open IoT platform

Steve Rogerson
January 5, 2016
 
Norwegian company Thin Film Electronics has been awarded a grant from the European Commission to create the world’s first IoT platform featuring open-source, open API (application programming interface) architecture.
 
As part of the EC’s Horizon 2020 research and innovation initiative, the grant will fund the TagItSmart project, through which Thin Film will partner with technology, consumer packaged goods and smart-products companies. For its part in the project, Thin Film will receive €472,312 over three years.
 
The focus of TagItSmart will be to create a global-scale IoT platform – built using open-source architecture – to support trillions of intelligent items and the data they generate. The platform will provide functionality and interoperability to integrate seamlessly with IoT-centric tools, technologies and software.
 
Ultimately, TagItSmart should help organisations effectively address problems regarding the management of IoT products and related services as they seek to capitalise on the growing sensorisation of objects.
 
TagItSmart aims to deliver functional capabilities, including the creation of smart markers using NFC or functional codes, the secure acquisition and consumption of contextual data, and the efficient creation and deployment of IoT-based services. To boost platform adoption, a set of industrial use cases will be identified and demonstrated.
 
Thin Film’s NFC OpenSense technology will be a component of the TagItSmart platform, and users will be able to access several related use cases that highlight commercial deployment of NFC OpenSense in the market.
 
“We’re pleased to be selected by the European Commission for participation in this exciting initiative,“ said Davor Sutija, CEO of Thin Film. “The TagItSmart project aligns well with our mission of making trillions of everyday objects smart through the use of printed electronics, and we look forward to working closely with our project partners.”
 
Thin Film’s partners on the project include Siemens, Unilever, Evrythng, VTT and the University of Surrey in the UK.
 
Thin Film Electronics is a publicly listed Norwegian company with headquarters in Oslo, Norway; product development and production in Linköping, Sweden; product development, production, and business development in San Jose, California; and sales offices in the USA, Hong Kong and Singapore.